| 摘要 |
A device ( 10 ) for suppressing electrostatic discharge comprises first and second multilayer structures ( 14, 16 ) surrounding an electrostatic discharge reactance layer ( 12 ), the resistance of said electrostatic discharge reactance layer ( 12 ) varying in response to the occurrence of an electrostatic discharge signal. Each multilayer structure ( 14, 16 ) comprises a barrier layer ( 18 ), a terminal layer ( 20 ) and an electrode layer ( 28 ). Alternatively, a conductive layer ( 80 ) can be used instead of a second multilayer structure ( 16 ). An ESD suppression device ( 110 ) can be embedded in a printed circuit board ( 122, 210 ) providing a way to protect board components from harmful ESD events.
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