| 摘要 |
A semiconductor device which comprises a semiconductor chip packaged in a resin package and having an electrode terminal wire-bonded to a conductor cap having one end defining an exposed top of an external connection terminal protruding from the resin package and the other end defining an orifice embedded in the resin package, wherein the orifice of the conductor cap has a radially outward extending flange which anchors the conductor cap to the resin package. The process of producing the semiconductor device is also disclosed. |
