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发明名称
METHOD FOR FORMING COPPER METALLIZATION LAYER INCLUDING LOCAL BARRIER METAL LAYER
摘要
申请公布号
KR100720515(B1)
申请公布日期
2007.05.15
申请号
KR20050131441
申请日期
2005.12.28
申请人
DONGBU ELECTRONICS CO., LTD.
发明人
HONG, JI HO
分类号
H01L21/28
主分类号
H01L21/28
代理机构
代理人
主权项
地址
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