| 摘要 |
In order to obtain a 3D circuit board manufacturing method capable of improving productivity and accuracy of circuit formation, the metal hoop material 1 provided with the positioning pilot holes 2 is employed. Since the 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes can be conducted on a roll 1A (winding of the hoop material 1) basis, which results that handling between the individual processes can be done more easily while increase of troubles and manufacturing costs can be prevented. Further, since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing can be conducted continuously with high precision while a tact time for the positioning work can be reduced. |
