发明名称 |
METHOD OF SEALING SEMICONDUCTOR ELEMENT MOUNTED ON GOLD PLATED PRINTED BOARDS |
摘要 |
Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing. |
申请公布号 |
KR20070049589(A) |
申请公布日期 |
2007.05.11 |
申请号 |
KR20060110001 |
申请日期 |
2006.11.08 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
TABEI EIICHI;YANAGISAWA HIDEYOSHI |
分类号 |
H01L23/29;H01L21/56;H01L23/31;H01L33/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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