Fabrication method of patterned conductive adhesives wafer level packages and image sensor module ISM using these packages,申请号KR20060042650-传众专利搜索

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发明名称	Fabrication method of patterned conductive adhesives wafer level packages and image sensor module ISM using these packages
摘要
申请公布号	KR100715858(B1)	申请公布日期	2007.05.11
申请号	KR20060042650	申请日期	2006.05.11
申请人		发明人
分类号	H01L27/146	主分类号	H01L27/146
代理机构		代理人
主权项
地址

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