| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chromaticity distribution uniform irrespective of the amount of an injected liquid resin with respect to a light-emitting diode package in which a resin is applied for sealing a light-emitting diode chip. <P>SOLUTION: This light-emitting diode package has an implement part 22 surrounded by side walls and comprises: a package main body 21 in which lead electrodes 23a, 23b are provided on the bottom surface of the implement part; a light-emitting diode chip 26 mounted on the bottom surface of the implement part and connected electrically with the lead electrodes; a resin packaging part 27 filled in the implement part for packaging the light-emitting diode chip; and an excessive resin storing part 28 formed on the upper surface of the packaging main body side wall for holding an excessive resin guided thereto which is excessive for forming the resin packaging part 27 having a predetermined height. <P>COPYRIGHT: (C)2007,JPO&INPIT |
