发明名称 CIRCUIT-EQUIPPED SUSPENSION SUBSTRATE ASSEMBLY SHEET, AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit-equipped suspension substrate assembly sheet wherein a circuit-equipped suspension substrate judged to be wrong has a judgement mark prevented from being flown out in a cleaning process, and capable of being formed to be small and securely; and also to provide a manufacturing method of the circuit-equipped suspension substrate assembly sheet. <P>SOLUTION: The circuit-equipped suspension substrate assembly sheet 1 includes a plurality of the circuit-equipped suspension substrates 2; and a support frame 3 for supporting each circuit-equipped suspension substrate 2 in an aligned state. In the sheet, the circuit-equipped suspension substrate 2 judged to be wrong has the judgement mark 4 formed by a struck trace, for discrimination from a circuit-equipped suspension substrate 2 judged to be good. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007115828(A) 申请公布日期 2007.05.10
申请号 JP20050304590 申请日期 2005.10.19
申请人 NITTO DENKO CORP 发明人 MIZUSHIMA AYA;FUNADA YASUTO;KITAJIMA MITSUHIRO
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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