| 摘要 |
An inspection method includes performing an inspection by applying a probe to pads of a contact check pattern located, together with a chip patterns on a wafer, and performing an inspection by applying the probe to pads of the chip pattern if a result of the inspection using the contact check pattern is within a predetermined range. A pattern having the same size as that of the chip pattern, differing in external appearance from the chip pattern, and having the same pads as those of the chip pattern is used as the contact check pattern.
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