摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact apparatus and a method for laser beam machining, by which apparatus and method, a substrate and a film can be processed by high-quality laser beam machining, and the installation floor space can be reduced to a minimum level. <P>SOLUTION: The apparatus for laser beam machining comprises a substrate lifting plate 37 having a first lifting shaft 50A, which is mounted on an X plate 36 and is arranged on one side of a pair of end sides in parallel to the X direction, and a second lifting shaft 50B arranged on the other end side. The substrate lifting plate 37 has a fixing portion 28 for mounting and fixing the substrate 100, and a Y plate 31 movable in the Y direction with respect to the substrate lifting plate 37 thereon. The substrate lifting plate 37 can turn about the first lifting shaft 50A and the second lifting shaft 50B within the tilting angle range from the horizontal direction to the vertical direction with respect to the horizontal surface of the X plate 31, and can be fixed to any position with respect to the X plate 31. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |