| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of realizing further higher output or longer service life by improving an effect of suppressing temperature rise in an LED chip, compared to a conventional configuration. <P>SOLUTION: In the light-emitting apparatus, a mounting substrate 20 is provided with a heat transfer plate 21 composed of a metal plate to be also used as a heat radiating plate. The LED chip 10 is mounted on one surface of the thickness direction of the heat transfer plate 21 via a plate-like submount member 30. The submount member 30 has an area larger than that of the LED chip 10, and the dimension of the submount member 30 is set so that the external circumferential part of the submount member 30 may come to the outside of a conical base in which an inscribed circle of an opposite surface to the submount member 30 in the LED chip 10 is an upper bottom surface and a circumscribed circle of the other surface in a thickness direction of the heat transfer plate 21 is a lower bottom surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
