发明名称 ETCHING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide etching liquid that prevents damage of a gate electrode at the time of etching a High-k film even if the High-k film of an Hf oxide system is used as a material of a gate insulating film is used and a metal is used as a material of the gate electrode, and to provide a manufacturing method of a semiconductor device using etching liquid. SOLUTION: The gate electrode 30 formed of a TiN layer 31, a Poly-si layer 32, and a W layer 33, is formed by dry etching, and wet etching using etching liquid is performed. Thus, a gate insulating film 20 is formed of an SiO<SB>2</SB>layer 21 and an HfSiO layer 22. Etching liquid comprises buffer suppressing dissociation of HF molecules and pH adjuster which raises a pH value. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007115732(A) 申请公布日期 2007.05.10
申请号 JP20050302593 申请日期 2005.10.18
申请人 RENESAS TECHNOLOGY CORP 发明人 KUME SATOSHI;AZUMA MASAHIKO;YOSHIGAMI JIRO;MARUYAMA TAKAHIRO;YAMANARI SHINICHI
分类号 H01L21/308;H01L29/78 主分类号 H01L21/308
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