| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer board using a prepreg instead of adhesives for laminating films for the purpose of preventing adhesives used for connecting the films each other from giving influence on the thinning, about the conventional multilayer printed wiring board having a plurality of films laminated, using the adhesives. SOLUTION: A plurality of both-sided boards 114a, 114b using films 102a, 102b are heated, pressure-welded, and laminated one above another halfway through a prepreg 130 and through-bumps 110 piercing the prepreg to electrically connect second wirings 106a, 106b each other previously formed on the both-sided board 114a, 114b. The second wirings 106a, 106b may be buried in the prepreg to absorb their wiring thickness, thus coping with the need of thinning the multilayer board. COPYRIGHT: (C)2007,JPO&INPIT |
