| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesion control method for stably supplying a film of improved adhesive power, in regard to adhesion control of a polyimide film. SOLUTION: The invention relates to adhesion control of the film of heat treating a pre-film at a temperature between 500°C or higher and 630°C or lower, wherein the pre-film is formed by cast applying and heating a composition containing an organic solvent solution of a polyimide precursor material. The adhesion control is made by adjusting the imide formation rate of the pre-film to 70% or higher, and residual volatile matters in the pre-film to 40 wt.% or lower; in a method to produce the polyimide film by further heat treating the pre-film which is formed by cast applying and heating the composition containing the organic solvent solution of the polyimide precursor material. COPYRIGHT: (C)2007,JPO&INPIT |
