| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit structure having a metal wiring opening up the possibilities of new applications such as an improvement in electrical characteristics such as a conformity to a reduction in the resistance of a conductive path and an increase in current requirements, especially the manufacture of passive components having good electrical characteristics, and provide its manufacturing method. SOLUTION: An integrated circuit structure 10 including at least three conductive structure levels 28, 42 and 52 with elongate conductive paths 34 and 48 arranged is manufactured by a single damascene. Thereby, via levels conventionally used are omitted, and various technical effects and the possibilities of new applications are produced. COPYRIGHT: (C)2007,JPO&INPIT |
