| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembling method where the transfer of heat to an optical circuit board from an electronic circuit board is suppressed, the mechanical strength of the connection between both boards is maintained and a wire bonding operation is performed, even when the electronic circuit board and the optical circuit board are mounted on metal bases which have different heights. SOLUTION: The electronic circuit board and the optical circuit board are mounted respectively on the metal bases, the two metal bases are connected, by using a connection member formed of a material such as a fiber-reinforced plastic or the like of small thermal conductivity and of large mechanical strength, a transmission line board is fixed to the two metal bases, and the optical circuit board and the transmission line board, as well as the electronic circuit board and the transmission line board, are electrically connected respectively by bonding wires. In a process in which their wire bonding operation is executed, a metal block of proper thickness is placed under the metal bases, and heights of their bottom faces are made equal. The two metal bases are fixed respectively to different radiation fins, and the two different radiation fins are fixed to a mounting board respectively individually. |
