EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD

摘要

The present invention discloses a thermosetting epoxy resin composition containing an epoxy resin having two or more epoxy groups in one molecule, a hardener having two or more functional groups that reacts with the epoxy groups in one molecule, and a photopolymerization initiator, and a method of forming a conductive film, a method of forming a conductive pattern, and a method of manufacturing a multilayered wiring board using the epoxy resin composition.