发明名称 BONDING APPARATUS AND BONDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding apparatus capable of effectively preventing abnormal discharge in a bonding operation by appropriately estimating the component lifetime of a cut clamper, and to provide a bonding method. <P>SOLUTION: The bonding apparatus performs bonding by generating the discharge between a torch rod in the lower part of a capillary and a wire, and forming a ball at the lower end of the wire. The apparatus includes a discharge voltage value alarm means for issuing alarm when a discharge voltage value V2 exceeds an alarm setting value between timings t1 and t2. In a process for repetitively generating the discharge, while changing the alarm setting value, the alarm setting value Vthn is detected and stored when the discharge voltage value alarm means issues the alarm. A voltage value obtained by adding a margin value to the alarm setting value Vthn is set as a discharge abnormal threshold. When the abnormal discharge is reported in automatic production, the state of the cut clamper is confirmed. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007116022(A) 申请公布日期 2007.05.10
申请号 JP20050308186 申请日期 2005.10.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SADAKANE KENICHIRO;MORI KENJI
分类号 H01L21/60 主分类号 H01L21/60
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