发明名称 |
ARRAY SUBSTRATE AND METHOD OF MANUFACTURING SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an array substrate for enhancing reliability and to provide a method of manufacturing the same. SOLUTION: The array substrate includes a substrate, an electrode pad, an insulating layer and a transparent electrode. The substrate includes a display region and a peripheral region adjacent to the display region. The electrode pad is in the peripheral region. The electrode pad includes a first metal layer and a second metal layer. The second metal layer is on the first metal layer, and includes an opening through which the first metal layer is partially exposed. The insulating layer is on the electrode pad and covers a side surface of the second metal layer in the opening and the exposed portion of the first metal layer. The transparent electrode is on the insulating layer, and is electrically connected to the first metal layer through a via hole in the insulating layer. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007114773(A) |
申请公布日期 |
2007.05.10 |
申请号 |
JP20060263998 |
申请日期 |
2006.09.28 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
AHN HYUN-JAE;LIM HYUN-SU;LEE INN-SUNG;AHN KI-WAN;BYUN JAE-SEONG |
分类号 |
G02F1/1345;G02F1/1368;H01L21/3205;H01L21/336;H01L23/52;H01L29/786 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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