| 摘要 |
PROBLEM TO BE SOLVED: To provide a patterning method in which metal elements composing an anti-diffusion layer are prevented from diffusing into other layer by forming a more compact anti-diffusion layer exhibiting good adhesiveness, and to provide an electronic device and an electronic apparatus. SOLUTION: The patterning method comprises a step for forming a barrier 30 on a substrate P, a step for arranging a conductive material 80a containing plating nuclei 26 in a patterning region 30a surrounded by the barrier 30, a step for forming a conductive layer 80 by calcinating the conductive material 80a arranged in the patterning region 30a, and a step for forming an anti-diffusion layer 82 on the conductive material 80a by electroless plating method using the plating nuclei 26 as a catalyst. COPYRIGHT: (C)2007,JPO&INPIT |
