SEALING RESIN COMPOSITION FOR PREAPPLICATION, AND PROCESS OF MANUFACTURING SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a sealing resin composition which is less apt to cause air inclusion during the temporary mounting of a semiconductor chip and is excellent in workability and reliability. SOLUTION: The sealing resin composition for preapplication comprises (A) an epoxy resin and (B) a hardener having flux activity, and has a tackiness after the B-stage of 0 to 5 gf/5 mmϕand a melt viscosity as measured at 130°C of 0.01 to 1.0 Pa s. COPYRIGHT: (C)2007,JPO&INPIT