发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a remarkably simplified method of forming a conductor circuit which does not require plating or resist by solving a problem of complicated process in a conventional method of forming a conductor circuit, and to provide a wiring board to be obtained by this method. SOLUTION: The method of forming a conductor circuit is characterized in that a layer of a silicon-containing polymer is formed on an insulation layer, the formed layer is irradiated with an ultraviolet ray or a visible light after light-shielding processing is applied to a portion where a circuit is formed, and the formed layer is allowed to contact a solution of a transition metal salt or a suspension, thereby forming a transition metal layer on the non-exposed layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007116036(A) 申请公布日期 2007.05.10
申请号 JP20050308482 申请日期 2005.10.24
申请人 MITSUI CHEMICALS INC;TOYOTA MOTOR CORP 发明人 TAKAHASHI MASAKI;IWATA KENJI;GOTO KENICHI;KAMATA JUN;TANAKA TORU
分类号 H05K3/10;H05K3/18 主分类号 H05K3/10
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