发明名称 |
METHODS OF PACKAGING A SEMICONDUCTOR DIE AND PACKAGE FORMED BY THE METHODS |
摘要 |
A method of packaging a semiconductor die (20). The method comprises mounting a semiconductor die (20) to a die attach pad (34) on a carrier (10) and electrically coupling an electrode (36) of the semiconductor die (20) and a contact pad (16) on the carrier (10) with a clip (54) carried by a sacrificial substrate (58). The method further comprises removing the sacrificial substrate (58) to release the clip (54). The method may be extended to accommodate a carrier (10) having multiple device regions (12, 13) each with a die attach pad (34) and a contact pad (16) for mounting multiple semiconductor die (20). |
申请公布号 |
WO2007052199(A1) |
申请公布日期 |
2007.05.10 |
申请号 |
WO2006IB53964 |
申请日期 |
2006.10.27 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;U.S. PHILIPS CORPORATION;DIJKSTRA, PAUL;GROENHUIS, ROELF |
发明人 |
DIJKSTRA, PAUL;GROENHUIS, ROELF |
分类号 |
H01L21/48;H01L21/60;H01L21/68;H01L23/31;H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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