| 摘要 |
A method of forming a bump, a method of forming an image sensor using the method, a semiconductor chip and the sensor so formed. According to a method of forming the bump, a conductive pad is used as a seed layer to form the bump by a plating process. Since the conductive pad is used as a seed layer, it is not necessary to form an additional aluminum pad or seed layer and the manufacturing process is simplified. The conductive pad and the bump are formed of the same materials simplifying the manufacturing a process. |
