| 摘要 |
A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap. The process uses flexible polyester and/or other films as a base component of the bridge. A wire is heated and embedded into the poly sheet at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction. The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips with the embedded wire and form a protected RFID circuit. |
