<p>In a liquid crystal driver mounted package (1a), a film substrate (2) and a liquid crystal driver (3) are connected through a driver socket (4a). Connection terminals on the film substrate (2) side of the driver socket (4a) have a pitch larger than that of connection terminals on the liquid crystal driver (3) side. Since wiring (5, 6) on the film of the film substrate (2) can be formed by using an existing technology, the liquid crystal drivers (3) can be formed with a finer pitch by using a microfabrication process.</p>
