发明名称 SUBSTRATE TREATMENT EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide substrate treatment equipment suppressing an eddy current flowing through a soaking pipe fitted between an electrode for applying a high frequency and a heater for a heating, and being capable of effectively converting a charged high-frequency power to a plasma. <P>SOLUTION: The substrate treatment equipment has a treating pipe 2 forming a space housing a substrate, the soaking pipe 16 arranged so as to coat the treating pipe 2 from the outside, and a heating means 4 arranged around the soaking pipe 16. The substrate treatment equipment further has a pair of the electrodes 6 and 7 arranged in the space between the treating pipe 2 and the soaking pipe 16 for receiving the application of the high-frequency power. Irregularities are formed to a surface on at least the electrode side of the soaking pipe 16. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007115883(A) 申请公布日期 2007.05.10
申请号 JP20050305460 申请日期 2005.10.20
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YASHIMA SHINJI
分类号 H01L21/205;C23C16/507;H01L21/3065;H05H1/46 主分类号 H01L21/205
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