| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for electrically connecting metal layers in both sides of a polyimide film in a laminated body having metal layers in both sides of the polyimide film with high productivity, in which the adhesion failure of the metal layer and a plated copper layer due to a pre-treatment method of via plating is improved, and thereby, defects caused from the adhesion failure of the metal layer and the plated copper layer can be reduced. SOLUTION: The present invention relates to the method for electrically connecting the metal layers by metal plating in both sides of the polyimide film 4 of the laminated body having the metal layers 2 and 3 in both the sides of the polyimide film. After forming a via in the metal layer and the polyimide layer in at least one side, removal of metal burr generated in the via forming step and cleaning treatment in an opening are performed simultaneously by wet blast method using a liquid in which abrasive grains with a diameter of 1 to 10μm are mixed. Thereafter, the metal layers are formed in the opening by metal plating and the metal layers in both sides are electrically connected through the formed via. COPYRIGHT: (C)2007,JPO&INPIT
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