发明名称 |
WIRING FORMING METHOD AND APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring forming method that excels in electrical reliability without generating coffee stains and migrations, which is made possible by rapidly forming a fine wiring using magnetic ink and also by uniformly distributing metallic particles in ink that are discharged. SOLUTION: At the stage of forming a wiring by discharging magnetic ink on the entire surface of a substrate, the magnetic ink is provided in a magnetic field. The magnetic field is provided by a magnetic field forming section located on the other surface of the substrate corresponding to the part where magnetic ink is discharged, and moves according to the movement of an ink-jet head from which the magnetic ink is discharged. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007116159(A) |
申请公布日期 |
2007.05.10 |
申请号 |
JP20060283003 |
申请日期 |
2006.10.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
SHIM IN KEUN;JOUNG JAE-WOO |
分类号 |
H01L21/3205;B05D1/26;B05D3/14;H01L21/288 |
主分类号 |
H01L21/3205 |
代理机构 |
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地址 |
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