| 摘要 |
In a method of manufacturing a semiconductor package, a semiconductor chip including a circuit unit that has a first circuit and a second circuit spaced apart from each other, a first conductive member for electrically connecting the first circuit to the second circuit and a cut-out portion for disconnecting the first and second circuits may be prepared. A test signal may be applied to the first circuit and the second circuit through the first conductive member to test the first and second circuits. The cut-out portion may be selectively removed in accordance with test results to divide the first conductive member into a first sub-conductive member electrically connected to the first circuit and a second sub-conductive member electrically connected to the second circuit. The first and second sub-conductive members may then be electrically connected to each other using a second conductive member.
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