Electrode package for semiconductor device

摘要

A plurality of isolated metal layers having the same shapes as electrodes are arranged in a matrix, and molded in a resin plate. The metal layers are exposed from both upper and lower surfaces of the resin plate. A cross-sectional area of each metal layer is increased with depth from the upper surface to the lower surface of the resin plate. A reinforcing frame is provided on a lower surface of the resin plate. The reinforcing frame is formed by a plurality of supports in their longitudinal direction being arranged along the periphery of the resin plate.