发明名称 |
Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement |
摘要 |
A method is disclosed for producing an integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement. The invention also relates to a method for producing aligning marks. During the method, a planarization is carried out before material is removed from an auxiliary indentation.
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申请公布号 |
US2007102819(A1) |
申请公布日期 |
2007.05.10 |
申请号 |
US20060527736 |
申请日期 |
2006.09.25 |
申请人 |
GOLLER KLAUS;HEITZSCH OLAF;NICHTERWITZ MARION |
发明人 |
GOLLER KLAUS;HEITZSCH OLAF;NICHTERWITZ MARION |
分类号 |
H01L23/544;G03F9/00;H01L21/4763 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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