METHOD AND DEVICE FOR MOLDING STRUCTURES

摘要

The invention relates to a method and a device for molding structures, in which a substrate (7) is placed on a substrate support (1) that is provided with one or several integrated ducts (5) to suck the substrate (7) with the aid of negative pressure. According to the inventive method, an intermediate plate (4) is inserted between the substrate support (1) and the substrate (7). Said intermediate plate (4) is separated from the substrate following the stamping process by moving apart the substrate support (1) and a tool support (2) that retains the stamping die (3) during said step. The intermediate plate (4) is then removed from the substrate support (1), and the substrate (7) is brought in contact with the substrate support (1) by moving the substrate support (1) and/or the tool support (2) in the opposite direction and is retained by a sucking effect. In the next step, the substrate (4) is separated from the stamping die (3) by moving apart the substrate support (1) and the tool support (2) which retains the stamping die. The disclosed method and the associated device make it possible to quickly and automatically change the substrate and automatically separate the substrate from the stamping die.