发明名称 |
WIRE BONDING CAPILLARY HAVING TWO-STEP HIGH BOTTLENECK |
摘要 |
<p>A two-step high bottleneck type capillary for a wire bonding device having a height of 1.5~5.0 mm and taper of 10~15° from the capillary end is disclosed. The capillary consists of a straight portion; a first bottleneck portion extending upwards from the end of the capillary to a first step with a first taper of 8~12°, said the first bottleneck portion having a first height of 0.1~0.5 mm from the end of the capillary to the first step; and a second bottleneck portion extending upwards from the first step to a second step on the border of the straight portion with a second taper of 10~15°, the second bottleneck portion having a second height of 1.1~5.0 mm from the end of the capillary to the second step.</p> |
申请公布号 |
KR100718889(B1) |
申请公布日期 |
2007.05.10 |
申请号 |
KR20050114006 |
申请日期 |
2005.11.28 |
申请人 |
LEE, JUNG KU |
发明人 |
LEE, JUNG KU;SUNG, HYUN BUM;LEE, HAE BAL;MOON, JUNG JU;LEE, KANG YONG |
分类号 |
H01L21/607;H01L21/60 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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