METHOD AND APPARATUS FOR ESTABLISHING OPTIMAL THERMAL CONTACT BETWEEN OPPOSING SURFACES
摘要
<p>To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package, it is necessary to align the surface of a semiconductor integrated circuit (IC) and a heat sink surface, where the heat sink contains a nano-composite wire structure. By using a self-aligned structure that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.</p>
申请公布号
WO2007053649(A2)
申请公布日期
2007.05.10
申请号
WO2006US42562
申请日期
2006.10.31
申请人
NANOCONDUCTION, INC.;XU, KEVIN;SUHIR, EPHRAIM;DANGELO, CARLOS