PHOTOSENSITIVE RESIN COMPOSITION

摘要

This invention provides a photosensitive resin composition that can be coated to a high film thickness, is developable with an alkali, has a high level of resolution, has a small level of residual stress after curing, can provide a cured product, which is excellent in various properties such as solvent resistance, thermal shock resistance, and adhesion, and is suitable for applications such as surface protective films, interlayer insulation films, and insulating films for high-density mount boards. The photosensitive resin composition comprises a polymer comprising predetermined repeating units, a solvent, which contains 10% by mass or more of at least one solvent having a boiling point of 100ºC or above at atomospheric pressure and selected from a predetermined group of solvents, and a photosensitive acid generating agent.