| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which reliability and optical output power are improved as compared with prior art. <P>SOLUTION: The light emitting device comprises: a frame 40 surrounding an LED chip 10 on the side of a mounting substrate 20 for mounting the LED chip 10; and a sealing portion 50 composed of silicon resin and sealing the LED chip 10 and bonding wires 14 and 14 on the inside of the frame 40. The mounting substrate 20 comprises: a heat transfer plate 21 mounting the LED chip 10; and a wiring board 22 having lead patterns 23 and 23 connected electrically with each electrode of the LED chip 10 and provided with a window 24 exposing the surface of the heat transfer plate 21 for mounting the LED chip 10. The LED chip 10 is mounted on the heat transfer plate 21 through a submount member 30, wherein each electrode formed on one surface side is connected with a different lead pattern 23, 23 through each bonding wire 14, 14. The frame 40 is formed of transparent resin, i.e. silicon resin. <P>COPYRIGHT: (C)2007,JPO&INPIT |
