| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for a fingerprint sensor with its sensor face less curved in pressing without using any interposer; and to provide a highly reliable semiconductor device for a fingerprint sensor less damaged by bending. <P>SOLUTION: A recess 8 (such as a groove 8a) is formed in an under surface of a semiconductor substrate 1 with a sensor surface 1a formed on its upper surface and an external terminal 4 formed on the under surface to provide a second sealing resin 7 for filling up the recess 8 therewith to seal the under surface. Since the hard sealing resin 7 is thickened by the depth of the recess 8, the flexural rigidity of a semiconductor device 100 for a sensor is increased. In another configuration, a reinforcing plate of an elastic body is provided on an under surface of the sealing resin 7 to increase the flexural rigidity. In a furthermore other configuration, a frame-like groove is provided along the periphery of the semiconductor substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
