| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be miniaturized and has high reliability. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 10 having a plurality of electrodes 14; a resin layer 15 provided on a surface of the semiconductor substrate 10 where the electrodes 14 are formed, and having a recess 17 formed on a second surface 19 opposite to a first surface 18 facing the semiconductor substrate 10; test pads 20 electrically connected to the electrodes 14 and formed in the inside of the recess 17; wirings 22, 32 electrically connected to the test pads 20, running over the second surface 19 of the resin layer 15 and each having a width smaller than that of a test pad 20; and a land 30 electrically connected to any one of the test pads 20 and having an external electrode 40 to be formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
