| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device and a cooling module that can maintain redundancy. <P>SOLUTION: A liquid-cooling endothermic member 23 is attached onto a heat transfer member 18. While a circulating pump 27 is in operation, the pump 27 distributes a cooling medium to a distribution channel for the liquid-cooling endothermic member 23. At this time, thermal energy of a heating element 14 is transferred from the heat transfer member 18 to the liquid-cooling endothermic member 23. The heating element's heat energy is transferred to the cooling medium in the distribution channel. The temperature of the cooling medium goes up. In this way, the heating element 14 is cooled off. In the meantime, the liquid-cooling endothermic member 23 can be attached onto the heat transfer member 18 so it can be detached. The liquid-cooling endothermic member 23 can be easily exchanged. At this time, heat energy of the heating element is transferred from the heat transfer member 18 to an air-cooling heat dissipater 19. In the air-cooling heat dissipater 19, heat energy can be dissipated from a large surface area into the air. The heating element 14 is cooled off in this way, resulting in maintenance of the redundancy of an electronic device. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
