| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency apparatus including a heat dissipation structure of a high frequency power amplifying element, which provides sufficient heat dissipation effects, even if the high frequency power amplifying element is used with a large calorific value. SOLUTION: The high frequency apparatus consists of: a circuit board 2 having the high frequency power amplifying element 3 including a heat dissipation fin 3b and a body 3a; a case 1 for storing the board 2; and a shield cover 6 to be put over the board 2. Heat generated by the element 3 is dissipated from the rear of the fin 3b to the case 1. In addition, to obtain further sufficient heat dissipation effects; a heat transmission cover 4 formed not in contact with the body 3a and mounted on the surface of the fin 3b, and a thermal conductor 8 thermally connecting the cover 4 with the shield cover 6, are provided so as to dissipate the heat generated by the element 3 to the shield cover 6 through the cover 4 and the conductor 8. COPYRIGHT: (C)2007,JPO&INPIT |
