| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device package capable of removing a photosensitive resin composite of an element mounting part with a simple process and without requiring a high cost tool and device such as a punching die, corresponding to a high-precision processing, and obtaining a satisfactory adhesive force between a substrate and a case; and to provide a semiconductor device package manufactured by the method. SOLUTION: The method for manufacturing the semiconductor device package having a substrate, an element mounted on the substrate, and the case for housing the element comprises the steps of coating a photosensitive resin composite on the substrate, removing the photosensitive resin composite from the element mounting part by an exposure and a development with the use of a mask, and adhering the substrate and the case by overlapping the case on the remaining photosensitive resin composite to heat and pressurize. The semiconductor device package manufactured by the method is provided. COPYRIGHT: (C)2007,JPO&INPIT
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