发明名称 Semiconductor chip and electronic component has chip(s) integrated into chip housing with four sets of conductive leads connected both to external contacts and to upper and lower housing surfaces
摘要 A semiconductor unit (1,10) comprises a semiconductor chip (2) integrated into a housing (3) that comprises four conductive leads ((11-14) connected both to external contracts (16a,16b,17a,17b) and to the underside (8) and upper side (9) of the chip housing. This permits a loop-back switching of many stacked semiconductor units without subsequent additional constructional alterations to the chip housing. An independent claim is also included for an electronic component as above comprising at least two units.
申请公布号 DE102006003377(B3) 申请公布日期 2007.05.10
申请号 DE20061003377 申请日期 2006.01.24
申请人 INFINEON TECHNOLOGIES AG 发明人 RUCKERBAUER, HERMANN
分类号 H01L23/50;G11C5/06;H01L23/498;H01L25/065 主分类号 H01L23/50
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