| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for bonding a tape with an IC tag to a sheet to generate no deformation and damage of a sheet material without damaging the IC tag when storing the sheet material, the sheet material obtained by the method, and also to provide the tape with the IC tag adhered to the sheet material. <P>SOLUTION: In this method, a process for preparing a tape roll 10 constituted by winding a thin belt-like tape 11 with a IC tag arranged with the plurality of IC tags at prescribed pitch, a process for adjusting and setting operation timing of a cutting device 101 in relation to supply amount of continuous sheets supplied to the cutting device 101, a process for paying out the tape 11 from an upstream side to a downstream side and adhering the tape 11 to the continuous sheet material, and a process for cutting the continuous sheet material adhered with the tape 11 by the cutting device 101 to obtain the sheet material are provided. The tape 11 is constituted of: a flexible tape base material; and the flexible IC tag. In the process for adjusting and setting the operation timing of the cutting device 101, the operation timing is adjusted every time paying-out of the tape roll 10 is started, and the cutting device 101 is operated to have cutting pitch equal to the arranging pitch of the IC tag so that the IC tag is put at a desired position in the cutting sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT |
