| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle having capability of electrically connecting the electrode of a semiconductor chip or an electronic component and the electrode of a mounted substrate to manufacture a conductive connection structure, and having excellent connection reliability by securing the junction area of a semiconductor package while materializing reduction of its height. SOLUTION: This conductive particle is to connect the electrode of the semiconductor chip or the electronic component to the electrode of the mounted substrate. In the conductive particle, a metal layer is formed on the entire surface of a columnar resin particle, the shape of the cross section obtained when cutting it by a plane parallel to its height direction is almost linearly symmetric with respect to the center line of the cross section, and the lower limit of the height is 150% of the diameter or the diagonal line length of its bottom face, and the upper limit of the height is 300% of the diameter or the diagonal line length of the bottom face. COPYRIGHT: (C)2007,JPO&INPIT
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