| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which an antenna mounted IC chip can be reduced in size, and cost and improved in function, its manufacturing method and an electronic component comprising the semiconductor device. <P>SOLUTION: The semiconductor device 1 is configured in the following. One or more through hole 4 communicating with one face from the other face are formed at prescribed positions of a semiconductor substrate 2 having an electrode 3 on one face. Next, a through electrode 6 is each formed through a first insulation part 5 in each formed through hole 4. Then, a first antenna circuit 8 is formed on one face side of the semiconductor substrate 2 through a second insulation part 7, wherein one end is electrically and directly connected to the first electrode 3 and the other end is electrically connected to one of through electrodes 6, and a second antenna circuit 18 is formed on the other face side of the semiconductor substrate 2 through a third insulation part 17, wherein one end is electrically connected to the other end of the first antenna circuit 8 through one of the through electrodes 6 and the other end is electrically connected to a second electrode (not shown) through another of the through electrodes 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
