| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal dissipation plate capable of radiating heat efficiently with a low temperature difference by unifying the thermal distribution of an entire flat plate, by absorbing variations when the distribution of the heating value of an electrical heating element, such as a plurality of semiconductor devices provided on the flat plate, varies. <P>SOLUTION: In the thermal dissipation plate, a plurality of linear pores are dispersed in a flat substrate made of a high heat transfer material and are arranged in parallel to form pore rows, respective pores in the pore rows are connected by a header channel at both the upper and lower ends, and a working fluid for transporting heat by a phase change is sealed in the pore rows. In the thermal dissipation plate, the sectional area of each pore in the pore rows is set to a size for preventing a vibration flow from occurring in the sealed working fluid, the sectional area of the header channel is set to a sectional area that is larger than that of each pore in the pore rows, and nearly the half of the entire volume of a sealed space formed in the substrate is filled with the working fluid. <P>COPYRIGHT: (C)2007,JPO&INPIT |
