发明名称 WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a wiring board capable of surely preventing deterioration and degradation of a material provided in a pixel area, a manufacturing method of a wiring board capable of easily manufacturing such a wiring board, and an electro-optical device as well as an electronic equipment with high reliability equipped with a wiring board. SOLUTION: An active matrix light-emitting device 10 illustrated is provided with a board 21 and a circuit part 22 formed on the board 21. In this case, a pixel area is formed on the circuit part 22 in correspondence with each driving TFT 24, and an organic EL element 1 is provided at each pixel area. Adjacent pixel areas are zoned by a barrier rib part (a bank) 35 constituted of a first barrier rib part 31 and a second barrier rib part 32. Further, the second barrier rib part 32 is constituted of a plasma polymerization film out of the barrier rib 35. Then, the wiring board consists of such barrier rib parts 35 and the board 21. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007115603(A) 申请公布日期 2007.05.10
申请号 JP20050307853 申请日期 2005.10.21
申请人 SEIKO EPSON CORP 发明人 MAKIURA RIE
分类号 H05B33/22;H01L51/50;H05B33/10;H05B33/12 主分类号 H05B33/22
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