Electronic unit, e.g. integrated circuit, has connecting wires connected between unit and conducting layer, where unit is installed on substrate having high conductivity and conducting layer is applied on insulation layer at selected points

摘要

The unit has a set of connecting wires connected between the electronic unit (A1) and a metallic conducting layer (C). The unit is installed on a metal substrate (A) that has high conductivity, and the metal substrate is covered by an oxidized insulation layer (B). The conducting layer is applied on the oxidized insulation layer at selected points by an electroplating process. The conducting layer is made of a set of conducting lines and has a set of metal clamping plates.