HOLLOW DIAMOND SHELLS FILLED COMPOSTTE MATERIALS

摘要

Disclosed is a composite material in which a hollow diamond shell is filled in a base material such as a polymer resin. A composite material, a highly-efficient thermal interface material that overcomes limits of an existing material, is provided by using a hollow diamond shell particle having a size of a few micrometers or tens of micrometers as a filling material of a thermal interface material (TIM) which is one of core materials of a semiconductor device. This composite material may be used as an underfill of a flip chip or an encapsulation filling material or may be used as a lightweight high-strength material for a space ship or the like.